The Profix® PLUS Pipe in Void System is a low-profile ‘dry-fit’ warm-water underfloor heating solution suited to well insulated buildings which, at a minimum, meet the latest requirements of Part L of the Building Regulations, and ideally Passivhaus standard.
14mm to 17mm diameter UFH pipework simply clips into the self-adhesive-backed Profix® PLUS Panels, followed by either T & G Flooring Grade Chipboard (or similar), or more thermally conductive T & G Dry Screed Replacement Board, onto which final floor coverings are then laid.
To find out how the Profix® PLUS Pipe in Void System can be used to create a dry-fit warm-water floor heating solution, check out the video below.
MEAN WATER TEMPERATURE | |||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|
400 | 400 | 500 | 500 | ||||||||
SYSTEM TYPE |
FLOOR COVERING | Heat Output W/m2 | Floor Surface Temp oC | Heat Output W/m2 | Floor Surface Temp oC | ||||||
Profix® PLUS Pipe in Void | 18mm Chipboard (no covering) | 31.6 | 22.9 | 49.8 | 24.2 | ||||||
18mm Screed Replacement Board (no covering) | 41.7 | 23.1 | 63.0 | 25.2 |
*For Guidance only - all systems must conform to BS EN 1264
Heat Output Table | |
---|---|
SYSTEM TYPE |
Profix® PLUS Pipe in Void |
FLOOR COVERING | 18mm Chipboard (no covering) |
MEAN WATER TEMPERATURE |
DESCRIPTION | VALUE |
---|---|---|
400 | Heat Output W/m<sup>2</sup>2 | 31.6 |
400 | Floor Surface Temp <sup>o</sup>C | 22.9 |
400 | Heat Output W/m<sup>2</sup>2 | 49.8 |
400 | Floor Surface Temp <sup>o</sup>C | 24.2 |
500 | Heat Output W/m<sup>2</sup>2 | |
500 | Floor Surface Temp <sup>o</sup>C | |
500 | Heat Output W/m<sup>2</sup>2 | |
500 | Floor Surface Temp <sup>o</sup>C | |
0 | Heat Output W/m<sup>2</sup>2 | |
0 | Floor Surface Temp <sup>o</sup>C |
Heat Output Table | |
---|---|
SYSTEM TYPE |
Profix® PLUS Pipe in Void |
FLOOR COVERING | 18mm Screed Replacement Board (no covering) |
MEAN WATER TEMPERATURE |
DESCRIPTION | VALUE |
---|---|---|
400 | Heat Output W/m<sup>2</sup>2 | 41.7 |
400 | Floor Surface Temp <sup>o</sup>C | 23.1 |
400 | Heat Output W/m<sup>2</sup>2 | 63.0 |
400 | Floor Surface Temp <sup>o</sup>C | 25.2 |
500 | Heat Output W/m<sup>2</sup>2 | |
500 | Floor Surface Temp <sup>o</sup>C | |
500 | Heat Output W/m<sup>2</sup>2 | |
500 | Floor Surface Temp <sup>o</sup>C | |
0 | Heat Output W/m<sup>2</sup>2 | |
0 | Floor Surface Temp <sup>o</sup>C |
*For Guidance only - all systems must conform to BS EN 1264
One of the major benefits of the Profix® PLUS Pipe in Void System is that it is a dry-fit system which avoids the drying times associated with liquid screed systems. Once the pipe has been clipped into the Profix® PLUS Panels, T & G flooring grade chipboard or more thermally conductive T & G dry screed replacement boards are laid directly on top of the panels, followed by your final floor covering, resulting in quicker construction and reduced labour costs.
The Profix® PLUS Pipe in Void System is a rapid installation system.
Each self-adhesive backed Profix® PLUS Panel features multiple pipe retention clips. These hold your 14- 17mm diameter pipe securely in place with pipe centres starting at 50mm and increasing in 50mm increments. Additionally, purpose made locking features fasten the panels together.
Because this system is dry-fit, unlike liquid screed systems there are no drying times involved. Once the panels are in place, T & G flooring grade chipboard or more thermally conductive T & G dry screed replacement boards are simply laid on top, followed by your final floor covering.
The high structural integrity of the Profix® PLUS Panels enables either T & G flooring grade chipboard (or similar) or T & G dry screed replacement boards to be laid over them as a floating floor. In addition to optimising heat output, the use of more thermally conductive T & G dry screed replacement boards enables a wide range of different final floor coverings to be applied. Tiles, luxury vinyl / linoleum, or laminate flooring can be bonded to the dry screed replacement boards for a fast and efficient installation. Alternatively, a low TOG carpet and underlay can be laid.
When bonding Tiles or Laminate Flooring onto T & G dry screed replacement boards the surface should first be primed using a suitable acrylic dispersion primer before applying a decoupling layer and cement-based adhesive, or before applying laminate flooring adhesive.
Low TOG Carpet & Underlay or Luxury Vinyl can be laid onto either T & G flooring grade chipboard (or similar) or onto T & G dry screed replacement boards. However, when laying Luxury Vinyl the surface of the boards should first be primed using a suitable acrylic dispersion primer and a thin skim-coat of Profix® Levelling Compound applied to obscure any joints and provide a completely smooth and level surface.
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